Semi-rigid TPU (55D–75D) print settings

Semi-rigid TPU (55D–75D) prints at about 230 °C with a 45 °C bed and 40% part cooling. Usable range 215–245 °C nozzle, 25–60 °C bed. No enclosure needed.

TPU 55DTPU 60DTPU 75DShore D TPUSemi-rigid TPUTPCHard TPU

Starting settings

Nozzle
215–245 °C (start 230)
Bed
25–60 °C (start 45)
Part fan
0–60% (start 40%)
Wall speed
20–45 mm/s
Max volumetric flow
6 mm³/s
Shrinkage
0.5%
Softens at
-30 °C
Enclosure
Not needed
Nozzle size
0.4 mm or larger — 0.4 mm recommended
Nozzle material
Brass is fine
Drying
50 °C for 6 h

Speed

Faster than the softer grades, 20–45 mm/s, and workable on Bowden where 85A really is not. Still slower than PLA.

Bed surface

Clean smooth PEI at 45 °C, no adhesive needed.

Nozzle

0.4 mm is fine — this grade is stiff enough not to need the help a softer one does.

What bites people

Safety

Open First Layer →
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